specifications of any and all sanyo semiconductor co.,ltd. products described or contained herein stipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer ' s products or equipment. to verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer ' s products or equipment. any and all sanyo semiconductor co.,ltd. products described or contained herein are, with regard to "standard application", intended for the use as general electronics equipment. the products mentioned herein shall not be intended for use for any "special application" (medical equipment whose purpose is to sustain life, aerospace instrument, nuclear control device, burning appliances, transportation machine, traffic signal system, safety equipment etc.) that shall require extremely high level of reliability and can directly threaten human lives in case of failure or malfunction of the product or may cause harm to human bodies, nor shall they grant any guarantee thereof. if you should intend to use our products for new introduction or other application different from current conditions on the usage of automotive device, communication device, office equipment, industrial equipment etc. , please consult with us about usage conditi on (temperature, operation time etc.) prior to the intended use. if there is no consultation or inquiry before the intended use, our customer shall be solely responsible for the use. o2611 sy 20110930-s00015/60811 sy/ 92910 sy 20100910-s00002 no.a1838-1/10 LV47011P overview the LV47011P is the ic for 4-channel btl power amplifier that is developed for car audio system. pch dmos in the upper side of the output stage and nch dmos in the lower side of the output stage are complimentary. high power and high quality sound are realized by that. this ic incorporate various functions (standby switch, muting function, and various protection circuit) necessary for car audio system. also, it has a self-diagnosis function. functions ? high output : p o max = 50w (typical) (v cc = 15.2v, f = 1khz, jeita max, r l = 4 ) : p o max = 29w (typical) (v cc = 14.4v, f = 1khz, thd = 10%, r l = 4 ) : p o max = 22w (typical) (v cc = 14.4v, f = 1khz, thd = 1%, r l = 4 ) ? built-in muting function (pin 22) ? built-in standby switch (pin 4) ? built-in self-diagnosis function (pin 25) : signal output in case of output offset detection, shorting to v cc , shorting to ground, and load shorting. ? electric mirror noise decrease ? built-in various protection circuit (shorting to ground, shorting to v cc , load shorting, over voltage and thermal shut down) ? no external anti-oscillation part necessary. note 1 : please do not mistake connection. a wrong connection may produce destruction, deterioration and damage for the ic or equipment. note 2 : the protective circuit function is provided to temporarily avoid abnormal state such as incorrect output connection. but, there is no guarant ee that the ic is not destroyed by the accident. the protective function do not operate of the operation guar antee range. if the outputs ar e connected incorrectly, ic destruction may occur when used outside of the ope ration guarantee range. note 3 : external parts, such as the anti-oscillation part, ma y become necessary depending on the set condition. check their necessity for each set. monolithic linear ic for car audio systems 4-channel btl power amplifier orderin g numbe r : ena1838b
LV47011P no.a1838-2/10 specifications maximum ratings at ta = 25 c parameter symbol conditions ratings unit maximum supply voltage v cc max1 no signal, t = 1 minute 26 v v cc max2 during operations 18 v maximum output current i o peak per channel 4.5/ch a allowable power dissipation pd max with an infinity heat sink 50 w operating temperature topr -40 to +85 c storage temperature tstg -40 to +150 c thermal resistance between the junction and case j-c 1 c/w recommended operating ranges at ta = 25 c parameter symbol conditions ratings unit recommended supply voltage v cc 14.4 v recommended load resistance r l op 4 operating supply voltage range v cc op a range not exceeding pdmax 8 to 16 v electrical characteristics at ta = 25c, v cc = 14.4v, r l = 4 , f = 1khz, rg = 600 parameter symbol conditions ratings unit min typ max quiescent current i cco r l = , rg = 0 200 400 ma standby current ist vst = 0v 3 a voltage gain vg v o = 0dbm 25 26 27 db voltage gain difference vg -1 +1 db output power p o thd = 10% 24 29 w p o max1 max power 45 w p o max2 v cc = 15.2, max power 50 w output offset voltage vn offset rg = 0 -100 +100 mv total harmonic distortion thd p o = 4w 0.03 0.12 % channel separation chsep v o = 0dbm, rg = 10k 55 65 db ripple rejection ratio svrr rg = 0 , fr = 100hz, v cc r = 0dbm 50 65 db output noise voltage v no rg = 0 , b.p.f. = 20hz to 20khz 80 150 vrms input resistance ri 40 50 65 k mute attenuation matt v o = 20dbm, mute : on 75 90 db standby pin control voltage vstby h amp : on 2.5 v cc v vstby l amp : off 0.0 0.5 v mute pin control voltage vmute h mute : off open - vmute l mute : on 0.0 1.0 v output offset detection detection threshold voltage vosdet 1.2 1.8 2.4 v * 0dbm = 0.775vrms
LV47011P no.a1838-3/10 package dimensions unit : mm (typ) 3236a block diagram sanyo : hzip25 2.0 29.2 25.6 (22.8) (2.6) (5.0) (12.3) (1.0) 0.52 (r1.7) 0.4 18.6 max (14.4) 4.5 (11.0) 3.5 21.7 14.5 4.2 4.0 (8.5) ( 2.5) 125 2.0 pd max -- ta -40 -20 0 20 40 60 80 100 120 140 160 0 10 20 30 40 50 60 70 ambient temperature, ta -- c maximum power dissipation, pd max -- w infinite heat sink j-c=1 c/w no heat sink j-a=39 c/w heat sink( f=3.5 c/w) j-c+ f=4.5 c/w + - + - out 1 + v cc 3/4 v cc 1/2 ta b v cc out 1 - pwr gnd1 r l protective circuit mute circuit stand by switch pwr gnd2 pwr gnd3 pwr gnd4 pre gnd 11 9 7 8 12 1 6 20 + 2 22 13 + ac gnd 16 25 r l r l r l + - + - out 2 + out 2 - mute 5v offset diag 5 3 + - + - out 3 + out 3 - 15 17 19 18 in4 14 stby 24 protective circuit 4 - ++ - out 4 + out 4 - 21 23 low level mute on +5v st on ripple filter dc 10 + in3 in2 in1 c1 c2 c6 c5 c3 c4 c8 c7 r2 r1 c9
LV47011P no.a1838-4/10 external components part name recommended value purpose remarks c1 to c5 0.47 f cuts dc voltage the larger the constant value, the lower the cut-off frequency the values of c1 to c5 must be the same c6 22 f reduces ripples reduces pop noise the larger the constant value, th e longer the amplifier on/off time c7 2200 f ripple filter eliminating power supply ripples c8 0.1 f improves oscillation stability reducing high-frequency noise c9 1 f reduces pop noise the larger the constant value, the longer the mute on/off time r1 10k reduces pop noise the larger the constant value, the longer the mute on/off time r2 4.7k pull-up resistor * the components and constant values within the test circuit are used for confirmation of characteristics and are not guarantee s that incorrect or trouble will not occur in application equipment. description of operation 1. standby switch function (pin 4) threshold voltage of the pin 4 is set by about 2vbe. the amplifier is turned on by the applied voltage of 2.5v or more. also, the amplifier is turned off by the applied voltage of 0.5v or less. fig1 standby equivalent circuit 2. muting function (pin 22) the muted state is obtained by setting pin 22 to the ground potential, enabling audio muting. the muting function is turned on by the applied voltage of 1v or less to the resistance of pin 22. and the muting function is turn off when this pin opens. also, the time constant of the muting function is determined by external capacitor and resistor constants. it is concerned with a pop noise in amplifier on/off an d mute on/off. after enough examination, please set it. fig2 mute equivalent circuit 3. acgnd pin (pin 16) the capacitor of the pin 16 must use the same capacitance value as the input capacitor. also, connect to the same pregnd as the input capacitor. 4 stby 10k 30k + mute mute off on 10k 18k 1 f about 50 a about 2.5v 200 22
LV47011P no.a1838-5/10 4. self-diagnostics function (pin 25) by detecting the unusual state of the ic, the signal is output to the pin 25. also, by controlling the standby switch after the signal of the pin 25 is detected by the microcomputer, the burnout of the speaker can be prevented. (1) shorting to v cc /shorting to ground : the pin 25 becomes the low level. (2) load shorting : the pin 25 is alternated between the low level and the high level according to the output signal. (3) output offset detection : wh en the output offset voltage exceed s the detection threshold voltage, the pin 25 becomes the low level. * note: the output offset abnormality is thought of as the leakage current of the input capacitor. in addition, the pin 25 has become the npn open collector output (active low). the pin 25 must be left open when this function is not used. 5. sound quality (low frequencies) by varying the value of input capacitor, low-frequency characteristic can be improved. however, it is concerned the shock noise. please co nfirm in each set when the capacitance value varies. 6. pop noise for pop noise prevention, it is recommended to use the muting function at the same time. ? please turn on the muting function simultaneously with power supply on when the amplifier is turned on. next, turn off the muting function after the output dc potential stabilization. ? when the amplifier is turn off, turn off the power supply after turning on the muting function. 7. oscillation stability pay due attention on the following points because parasitic oscillation may occur due to effects of the capacity load, board layout, etc. (1) capacity load when the capacitor is to be inserted between each output pin and gnd so as to prevent el ectric mirror noise, select the capacitance of maximum 1500pf. (conditions : our recommended board, r l = 4 ) (2) board layout ? provide the v cc capacitor of 0.1 f in the position nearest to ic. ? pregnd must be independently wired an d connected to the gnd poin t that is as stable as possible, such as the minus pin of the 2200 f v cc capacitor. in case of occurrence of parasitic oscillation, any one of following parts may be added as a countermeasure. note that the optimum capacitance must be ch ecked for each set in the mounted state. ? series connection of cr (0.1 f and 2.2 ) between btl outputs ? series connection of cr(0.1 f and 2.2 ) between each output pin and gnd.
LV47011P no.a1838-6/10 0 50 100 150 200 300 0 2 4 6 8 10 12 14 616 8 10 12 14 8 10 12 14 16 18 0.01 10 10 0.1 23 57 23 57 23 57 110 23 57 23 57 23 57 23 57 100 1k 10k 100 10 100k 0 10 20 30 40 0.1 1 2 3 5 7 2 3 5 7 2 3 5 7 50 0 5 10 15 20 25 810121416 237 5237 5237 5237 5 100 1k 10k 18 thd -- p o 0.01 2 3 5 7 0.1 2 3 5 7 2 3 5 7 1 0.01 2 3 5 7 0.1 2 3 5 7 2 3 5 7 1 10 0.1 23 7 110 5237 5237 5 1 257 3257 3257 3 10 100 thd -- p o thd -- f 0.01 2 3 5 7 0.1 2 3 5 7 2 3 5 7 1 10 0.1 100 10 100k 618 i cco -- v cc thd -- p o v n -- v cc p o -- v cc p o -- f all channel is similar all channel is similar ch1 ch3 ch2 ch4 ch1 ch3 ch2 ch4 ch1 ch3 ch2 ch4 ch1 ch3 ch2 ch4 250 supply voltage , v cc -- v quiescent current , i cco -- ma supply voltage , v cc -- v output power , p o -- w output power , p o -- w total harmonic distortion , thd -- % output power , p o -- w total harmonic distortion , thd -- % frequency , f -- hz total harmonic distortion , thd -- % frequency , f -- hz output power , p o -- w supply voltage , v cc -- v output midpoint voltage , v n -- v output power , p o -- w total harmonic distortion , thd -- %
LV47011P no.a1838-7/10 -- 3 -- 2 -- 1 0 1 0 50 100 150 10 100 2 3 57 2 3 57 2 3 57 2 3 57 1k 10k 100 2 3 57 2 3 57 2 3 57 2 3 57 1k 10k 100 2 3 57 2 3 57 2 3 57 2 3 57 1k 10k 100 2 3 57 2 3 57 2 3 57 2 3 57 1k 10k 100 2 3 57 2 3 57 2 3 57 2 3 57 1k 10k 100 2 3 57 2 3 57 2 3 57 2 3 57 1k 10k 100 2 3 57 2 3 57 2 3 57 2 3 57 1k 10k 100k 0 80 80 81012141618 10 100k 0 20 40 60 20 40 60 80 0 20 40 60 80 10 100k ch.sep -- f 0 20 40 60 0 20 40 60 80 10 100k ch.sep -- f svrr -- f r 0 20 40 60 80 10 100k 10 100k 10 100k respomse -- f svrr -- v cc v no -- rg ch.sep -- f ch.sep -- f all channel is similar ch1 ch1 ch2 ch1 ch4 ch1 ch3 ch2 ch1 ch2 ch4 ch2 ch3 ch3 ch1 ch3 ch4 ch3 ch2 ch4 ch1 ch4 ch3 ch4 ch2 ch3 ch2 ch4 ch1 ch3 ch2 ch4 ch1 ch3 ch2 ch4 frequency , f -- hz response -- db frequency , f -- hz channel separation -- db frequency , f -- hz channel separation -- db frequency , f -- hz channel separation -- db ripple frequency , f r -- hz ripple rejection ratio , svrr -- db frequency , f -- hz channel separation -- db output noise voltage , v no -- v supply voltage , v cc -- v ripple rejection ratio , svrr -- db
LV47011P no.a1838-8/10 0 1 2 3 4 0 10 20 30 40 50 60 810121416 2357 1 23 57 23 57 10 18 0 50 100 150 200 300 0 20 40 60 80 100 0 1.0 2.0 3.0 4.0 1.0 2.0 3.0 4.0 5.0 0 5.0 0.1 100 offset diag -- v cc pd -- p o i cco -- vst mute att -- v mute detection level v cc = 14.4v v cc = 16v 250 supply voltage , v cc -- v detection threshold voltage , vosdet -- v standby control voltage , vst -- v quiescent current , i cco -- ma mute control voltage , v mute -- v mute attenuation , mute att -- db output power , p o -- w power dissipation , pd -- w
LV47011P no.a1838-9/10 hzip25 heat sink attachment heat sinks are used to lower the semiconductor device junction temperature by leading the head generated by the device to the outer environment and dissipating that heat. a. unless otherwise specified, for power ics with tabs and pow er ics with attached heat sinks, solder must not be applied to the heat sink or tabs. b. heat sink attachment use flat-head screws to attach heat sinks. use also washer to protect the package. use tightening torques in the ranges 39-59ncm(4-6kgcm) . if tapping screws are used, do not use screws with a diameter larger than the holes in the semiconductor device itself. do not make gap, dust, or other contaminants to get between the semiconductor device and the tab or heat sink. take care a position of via hole . do not allow dirt, dust, or other contaminants to get between the semiconductor device and the tab or heat sink. verify that there are no press burrs or screw-hole burrs on the heat sink. warping in heat sinks and printed circuit boards must be no more than 0.05 mm between screw holes, for e ither concave or co nvex warping. twisting must be limited to under 0.05 mm. heat sink and semiconductor device are mounted in parallel. take care of electric or compressed air drivers the speed of these torque wrench es should never exceed 700 rpm, and should typically be about 400 rpm. c. silicone grease spread the silicone grease evenly when mounting heat sinks. sanyo recommends yg-6260 (momentive performance materials japan llc) d. mount first mount the heat sink on the semiconductor device, and then mount that assembly on the printed circuit board. when attaching a heat sink after mounting a semiconducto r device into the printed circuit board, when tightening up a heat sink with the screw, the mechanical stress which is impossible to the semiconductor device and the pin doesn't hang. e. when mounting the semiconductor device to the heat sink using jigs, etc., take care not to allow the device to ride onto the jig or positioning dowel. design the jig so that no unreas onable mechanical stress is not app lied to the semiconductor device. f. heat sink screw holes be sure that chamfering and shear drop of heat sinks must not be larger than the diameter of screw head used. when using nuts, do not make the heat sink hole diameters larger than the diameter of the head of the screws used. a hole diameter about 15% larger than the diameter of the screw is desirable. when tap screws are used, be sure that the diameter of the holes in the heat sink are not too small. a diameter about 15% smaller than the diameter of the screw is desirable. g. there is a method to mount the semiconductor device to the heat sink by using a spring band. but this method is not recommended because of possible displ acement due to fluctuation of the spring force with time or vibration. binding head machine screw countersunk head mashine screw heat sink gap via hole
LV47011P ps no.a1838-10/10 this catalog provides information as of october, 2011. specifications and information herein are subject to change without notice. sanyo semiconductor co.,ltd. assumes no responsib ility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specifications of any and all sanyo semiconductor co.,ltd. products described or contained herein. sanyo semiconductor co.,ltd. strives to supply high-quality high-reliab ility pr oducts, however, any and all semiconductor products fail or malfunction with some probab ility. it is possible that these pr obab ilistic failures or malfunction could give rise to accidents or events that could endanger human lives, trouble that could give rise to smoke or fire, or accidents that could cause dam age to other property. when designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. such measures include but are not limited to protective circuits and error prevention circuits for safe design, redundant design, and structural design. upon using the technical information or products described herein, neither warranty nor license shall be granted with regard to intellectual property rights or any other rights of sanyo semiconductor co.,ltd. or any third party. sanyo semiconductor co.,ltd. shall not be liable for any claim or suits with regard to a third party's intellctual property rights which has resulted from the use of the technical information and products mentioned above. any and all information described or contained herein are subject to change without notice due to product/technology improvement, etc. when designing equip ment, refer to the "delivery specification" for the sanyo semiconductor co.,ltd. product that you intend to use. in the event that any or all sanyo semiconductor co.,ltd. products described or contained herein are controlled under any of applicable local export control laws and regulations, such products may require the export license from the authorities concerned in accordance with the above law. no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written consent of sanyo semiconductor co.,ltd.
|
